PCB Layout and Circuit Analysis Techniques to Maximize RF/High Speed Performance

Course Objectives:

This three-day course enables practicing engineers and CAD technicians to develop design rules for RF and high-speed designs, choose an optimal design tool, and organize the design process to most efficiently execute the design that will insure circuit performance, and minimize costs and production time. The goal is to improve the engineers’ RF/high speed layout knowledge to reduce the number of board turns. Upon completing the course, participants will be able to:

  1. Discuss fundamental RF and digital PCB design issues.
  2. Compare and contrast transmission lines types, characteristics, and situations in which they can be used.
  3. Describe, evaluate, and compare termination types, PCB materials and fabrication processes, and packaging types.
  4. Identify and compensate for sources of interference - EMI and EMC.
  5. Measure and fine-tune circuit performance.
  6. Identify and select tools for analyzing RF and High Speed PCB layouts.
  7. Develop a set of RF/High Speed Layout rules.

 

Course Outline:
Day One:

  1. Fundamentals of RF and High Speed Data.
  2. Understanding the difference between RF and Speed
  3. Matching Techniques
  4. Power Vs Signal Integrity

Day Two:

  1. Transmission Line Fundamentals
  2. The Connecting Link Between two RF Sources
  3. Via’s
  4. The PCB Multi- Layer Interconnect

Day Three:

  1. PCB Design Structures and Materials Types
  2. The Starting Point in Understanding PCB Layout Challenges
  3. Shielding
  4. Minimizing EMI/EMC/RFI

 

Who Should Attend:

  1. Design engineers/technicians from the electronics industry involved in EMI and SIGNAL INTEGRITY (SI) problems.
  2. Those interested in a working knowledge of EMI/SI engineering principles and concerned with EMI/SI problems as high speed digital designers, RF designers and PCB layout engineers.
  3. Managers responsible for design, production, test and marketing of electronic products.
  4. Marketing engineers who need a general and practical knowledge of the EMI/SI basics.

 

Date of Programme:
10 – 12 Jul 2017

Time:
09.00am – 5.30pm

Venue:
16 Jalan Kilang #03-05 Singapore 159416

Course Fees:
S$3,699

How to Register:
Please register at: http://www.wizlogix.com/event/detail/pcb-layout-and-circuit-analysis-techniques-to-maximize-rf-high-speed-performance.

UTAP Details:
NTUC Members enjoy 50% unfunded course fee support for up to *$250 each year when you sign up for courses supported under UTAP (Union Training Assistance Programme). *Conditions apply

Please visit our website at http://skillsupgrade.ntuc.org.sg for more information. Funding for approved courses only.

Training Provider:

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